Tiny PICs with Huge Impact: Meeting the Challenges of Photonic Integrated Circuits testing for next-generation networks

In this webinar, discover how the collaborative EXFO, HPE, and MPI PIC testing solution addresses market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers. This topic shines a light on photonic wafers as critical building blocks for next-generation networks, laying the groundwork for 5G deployment and high-speed data centers.

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Speakers

	Sebastian Giessmann Product Marketing Manager MPI Corporation
	Lawrence Van de Vegt Subject Matter Expert EXFO
	Ashkan Seyedi Senior Research Scientist Hewlett Packard Enterprise