The webinar, presented by Tom Skoczylas in USA & Europe and by Luc Zhu, Chief Representative in China will cover Annealing, Epitaxy, Deposition, Stabilizing, and Lithography, includes a 20 minute Live Q&A session.
Edge computing has quickly emerged as one of the top data centre trends, and we only see this pattern accelerating as the need for high-speed connectivity increases over the next 10 years. Edge, mobile edge and fog computing are being utilised to speed content delivery, improve services and localise analytics. However, these distributed and remote locations, often with no local IT support, produce additional challenges for the data centre and IT teams as they seek to ensure a seamless, always-on application service, whatever the infrastructure and wherever the data resides.
Compound semiconductor materials are used in a wide range of current and emerging applications including LEDs, laser diodes, IR detectors, RF filters, RF power amplifiers, supercomputing and quantum dots. These applications cover a wide range of device complexity and production levels. However, for thin film deposition there are a number of common considerations. In this webinar, process and equipment engineers at compound semi manufacturers will discover how a customizable turnkey thin film deposition solution will deliver the consistency and reliability that their applications demand, while providing a lower cost of ownership. The right solution should be enhanced with in-situ controls to ensure production process control and efficiency when manufacturing compound semiconductor devices, especially at large volumes requiring high throughput.