This roundtable will delve into the latest advancements in hybrid cooling technologies, combining traditional air cooling with innovative liquid cooling systems. Attendees will explore the benefits of hybrid cooling, such as enhanced energy efficiency, reduced operational costs, and improved environmental sustainability. Industry experts will share case studies, best practices, and implementation strategies, offering a comprehensive understanding of how hybrid cooling can optimize data centre performance. Join us to network with peers, discuss emerging trends, and gain actionable insights to future-proof your data centre infrastructure. Importance: Understanding how hybrid cooling systems can significantly enhance energy efficiency and reduce operational costs, while simultaneously supporting sustainability goals. Raman microscopy is a powerful tool for semiconductor research that can non-destructively acquire high-resolution, spatially resolved information to determine the chemical composition of a sample, visualize component distribution, and characterize properties such as crystallinity, strain, stress or doping. This is particularly valuable for compound semiconductors, which often consist of multiple elements and complex structures. In this webinar we will introduce the principles of 3D Raman imaging and the speaker will show in detail how to access chemical imaging at the highest spatial and spectral resolution. The measurements will demonstrate how Raman imaging can provide insights on stress, doping and topographic variation in a large-area wafer and on layered semiconducting materials. Please join us to learn about the fundamentals of enhanced 3D Raman and photoluminescence imaging at the highest spectral and spatial resolution for semiconductor applications. You will see exciting demonstration measurements on semiconducting materials, including compositional analysis, stress and strain characterisation, depth profiling and defect analysis.
The AFBR-S50 optical sensor modules are multi-pixel distance and motion measurement devices based on the indirect Time-of-Flight (iTOF) principle. In this webinar we will present the Broadcom® AFBR-S50 TOF-sensor family, how it works, and how it helps you to solve your sensing problems. Following an introduction to the working principle, we will present the technology, which has been specifically developed for industrial applications which need high speeds, excellent accuracy, small size and reliable distance readings. You will learn how Broadcom’s sophisticated ambient light suppression techniques enable the use of our sensors in outside environments (including in full sunlight) and you will see that the sensor produces reliable measurements against white, black, and coloured target surfaces as well as metallic and retro-reflective surfaces. To conclude, we will show some typical applications and use-cases and how the AFBR-S50 sensors can be applied to solving specific and real-world problems.
The current data centre sustainability conversation seemingly does not allow for any variation from the message that data centres will achieve Net Zero by, if not well before, 2050. Quite what this Net Zero looks like, well that's not so easily defined. Somewhat worryingly, the conviction that the industry will unquestionably reach Net Zero is supported by an equally firm belief that this objective can be obtained by, in simple terms, continuing the current data centre technology evolution. No revolution is required.
This Centiel-sponsored roundtable begs to differ as it brings together the UPS supply chain to discuss the energy efficiency revolution which has already begun in the data centre and looks ahead to understand what more needs to be achieved. The conversation will focus on the innovative approaches to energy efficiency being delivered to the data centre today - thanks to a combination of new ways of thinking about the ‘power problem' and the groundbreaking technology designs which can provide truly sustainable UPS solutions.
Hear from a UPS manufacturer, a data centre operator and a data centre infrastructure specialist as they talk data centres and Net Zero in practical terms. Contrary to recent, certain unhelpful suggestions that sustainability will make you poorer, this roundtable will, once and for all, demonstrate beyond all reasonable doubt that UPS-inspired data centre energy efficiency is good for both the environment and the corporate bank balance.
Explores key advantages in Silicon Photonics fabrication through the CORNERSTONE programme at the University of Southampton, UK. Introducing us to CORNERSTONE is Graham Reed - Professor of Silicon Photonics at the University. In addition to leading CORNERSTONE, Professor Reed is a pioneer within SiP - He established the Silicon Photonics Research Group in Surrey in 1989 - One of Professor Reed's students, Dr. Andrew Rickman, went on to found Bookham Technology, now Lu-men-tum. Professor Reed holds 19 patents, has written 2 books including the very first SiP textbook - He has published more than 500 articles and delivered more than 140 international presentations. Professor Reed has received multiple industry awards, the most recent in 2019 when he received a PIC Award for individual contributions to the field. Joining Professor Reed today is Dr. Callum Littlejohns, CORNERSTONE coordinator and Principal Enterprise Fellow at the University of Southampton, UK. His track record of excellence includes multiple awards including the best submission at the Open Compute Project Regional Summit Future Technologies Symposium in 2019 and the 2015 Information Overload category winner at the E-P-S-R-C I-C-T Pioneers Awards. He has published a book chapter, over 30 papers in peer-reviewed journals, more than 100 international conference papers and has 3 patents.
Compound semiconductor materials are used in a wide range of current and emerging applications including LEDs, laser diodes, IR detectors, RF filters, RF power amplifiers, supercomputing and quantum dots. These applications cover a wide range of device complexity and production levels. However, for thin film deposition there are a number of common considerations. In this webinar, process and equipment engineers at compound semi manufacturers will discover how a customizable turnkey thin film deposition solution will deliver the consistency and reliability that their applications demand, while providing a lower cost of ownership. The right solution should be enhanced with in-situ controls to ensure production process control and efficiency when manufacturing compound semiconductor devices, especially at large volumes requiring high throughput.
In this webinar, discover how the collaborative EXFO, HPE, and MPI PIC testing solution addresses market challenges, making wafer testing faster, scalable, and more reliable, ultimately improving speed-to-market for component manufacturers. This topic shines a light on photonic wafers as critical building blocks for next-generation networks, laying the groundwork for 5G deployment and high-speed data centers.
An individual fab can use tens of millions of gallons of water per day, the equivalent to the daily household water consumption of a small city (population 122,000).
Grundfos experts will discuss how today’s technology can help companies advance toward their net zero targets while also addressing the water challenges through reuse and optimization solutions.
Join Grundfos Pumps Corporation for our roundtable to obtain insights from the semiconductor market and the critical role of water solutions and pumps in achieving efficient operations.
This Grundfos-hosted roundtable aims to provide valuable insights into meeting sustainability goals and overcoming operational challenges in the industry.
In this webinar we present a novel concept that adds various spectroscopies on any optical microscope - the so-called Standard Microscope Spectroscopy Systems or SMS. Because our design decouples the key optics required from spectroscopy from that of imaging, it enables functional optimization of spectroscopic performance without compromises to the native imaging functions of the microscope. Furthermore, by being a flexible and modular design, SMS systems enable multiplexing of different complimentary spectroscopies on one platform. This is not only affordable but also facilitates acquisition of different but complimentary spectra from the same micro-point on the sample. This functionality can be readily added to a user's existing microscope.
There are many factors that affect wafer yield such as uniformity and defectivity amongst others. Currently optical spectroscopies such as Raman and Photoluminescence are some of the techniques of choice in assessing these wafer performance parameters.
In this webinar, we show the relevance of applying spectroscopic tools such Raman, Photoluminescence, Time-Resolved Photoluminescence and Cathodoluminescence in characterizing key wafer performance parameters for wide bandgap materials. We also address some of the unique challenges in doing these measurements for wide bandgap semiconductors and how to overcome them.
The Irish Government through DCCAE, have published its consultation on the design of the Renewable Electricity Support Scheme (RESS) in Ireland to encourage sufficient levels of renewable energy and meet national and EU targets.
A must-attend webinar for data center professionals aiming to safely raise operating temperatures, boost performance, reduce airflow leakage, and slash costs.
In this session, you'll uncover the secrets of optimizing airflow down to the rack level for unparalleled energy efficiency and sustainability. From navigating the latest regulations to surpassing industry standards in the data center, this webinar offers invaluable insights and practical strategies to transform operational efficiency.
Join industry leaders from Minkels and Equinix to discover how understanding airflow management can be your key to a greener, more cost-effective data center.
LIGENTEC is your manufacturing partner for low loss silicon nitride photonic integrated circuits. Our customers benefit from a clear path to volume production while obtaining also small quantities of wafers with the performance, short turn around and high yield required at the early stage of proof of concept.
This webinar will provide an overview of the current LIGENTEC capabilities showcased by application examples in Communication, Sensing, Quantum technologies and LiDAR. We will also give a short overview of our multi-project wafer runs and dedicated run possibilities.
Be one of the first to learn about this revolutionary approach, which gives enterprises an alternative to restrictive & expensive storage solutions with an API first approach to storage.
Cloud-defined storage is a flexible, on-prem and server-based enterprise-class storage solution that is defined and managed through the cloud. CDS consumes no server CPU or memory resources, but you still get all of the features of enterprise storage without the expense or footprint. The icing on the cake? You manage it, and the rest of your infrastructure, through the cloud, providing you with insights, self-managed updates and powerful programmability at any scale.
Reserve your spot for this exclusive event to learn how to make your deployment simple from day 1 all the way to day 1000.
The CHIPS & Science Act, along with evolving domestic content regulations for electric vehicles and charging infrastructure subsidies, continues to drive significant investment in semiconductor fabrication facilities across the United States. As these fabs expand, their demand for ultrapure hydrogen gas remains critical for applications such as carrier gas and wafer annealing. The hydrogen supply landscape for semiconductor manufacturing is evolving. From traditional delivery methods to on-site generation, the industry is witnessing a shift towards more sustainable and efficient solutions. Among these, the commercial viability of ultrapure hydrogen generation through modern PEM (Proton Exchange Membrane) water electrolysis is gaining traction. Key Benefits of On-Site PEM Hydrogen Generation: Minimal Hydrogen Inventory: Enables flexible site planning and reduced storage needs. Sustainable Production: Achieves zero carbon emissions when powered by renewable energy sources. Reliable Supply: Provides a consistent and high-purity hydrogen supply with minimal staffing requirements. High Purity and Pressure: Ensures that the hydrogen meets stringent semiconductor manufacturing standards. Scalability: Easily adapts to the varying demands of semiconductor operations. This presentation will explore the latest advancements in on-site PEM hydrogen generation technology and its implications for the semiconductor industry. Attendees of the live event will receive a Professional Development Seminar Certificate of Completion issued by Nel Hydrogen.
The CHIPS & Science Act, along with evolving domestic content regulations for electric vehicles and charging infrastructure subsidies, continues to drive significant investment in semiconductor fabrication facilities across the United States. As these fabs expand, their demand for ultrapure hydrogen gas remains critical for applications such as carrier gas and wafer annealing. The hydrogen supply landscape for semiconductor manufacturing is evolving. From traditional delivery methods to on-site generation, the industry is witnessing a shift towards more sustainable and efficient solutions. Among these, the commercial viability of ultrapure hydrogen generation through modern PEM (Proton Exchange Membrane) water electrolysis is gaining traction. Key Benefits of On-Site PEM Hydrogen Generation: Minimal Hydrogen Inventory: Enables flexible site planning and reduced storage needs. Sustainable Production: Achieves zero carbon emissions when powered by renewable energy sources. Reliable Supply: Provides a consistent and high-purity hydrogen supply with minimal staffing requirements. High Purity and Pressure: Ensures that the hydrogen meets stringent semiconductor manufacturing standards. Scalability: Easily adapts to the varying demands of semiconductor operations. This presentation will explore the latest advancements in on-site PEM hydrogen generation technology and its implications for the semiconductor industry. Attendees of the live event will receive a Professional Development Seminar Certificate of Completion issued by Nel Hydrogen.
The webinar, presented by Tom Skoczylas in USA & Europe and by Luc Zhu, Chief Representative in China will cover Annealing, Epitaxy, Deposition, Stabilizing, and Lithography, includes a 20 minute Live Q&A session.
In this webinar, photonic integrated circuit design, simulation, and optimization will be demonstrated using 3rd party EDA tools combined with Optiwave software.
Building fab-based photonic design kit components using 3D EM simulation tools will be shown. Simulation results for a PIC chip optimized using the OptiSPICE plugin will be demonstrated.
Semiconductors are the materials from which the engines of the information age are built, and their advancement is among the most vital endeavours in technology. The first step in their production generally involves crystal growth and sectioning into thin wafers. The wafers are then altered using methods such as doping to give them specific electronic properties. Access to the subtlest details of these chemical and structural modifications on the sub-micrometer scale is crucial in new device development and final product quality control. Raman microscopy is a powerful tool for semiconductor research that can non-destructively acquire high-resolution, spatially resolved information to determine the chemical composition of a sample, visualize component distribution, and characterize properties such as crystallinity, strain, stress or doping. This is particularly valuable for compound semiconductors, which often consist of multiple elements and complex structures. In this webinar we will introduce the principles of 3D Raman imaging and the speaker will show in detail how to access chemical imaging at the highest spatial and spectral resolution. The measurements will demonstrate how Raman imaging can provide insights on stress, doping and topographic variation in a large-area wafer and on layered semiconducting materials. Please join us to learn about the fundamentals of enhanced 3D Raman and photoluminescence imaging at the highest spectral and spatial resolution for semiconductor applications. You will see exciting demonstration measurements on semiconducting materials, including compositional analysis, stress and strain characterisation, depth profiling and defect analysis.
Physik Instrumente and Tegema hosted a live webinar in association with PIC Magazine, focusing on Assembly and Packaging of Photonic Integrated Circuits.
Edge computing has quickly emerged as one of the top data centre trends, and we only see this pattern accelerating as the need for high-speed connectivity increases over the next 10 years. Edge, mobile edge and fog computing are being utilised to speed content delivery, improve services and localise analytics. However, these distributed and remote locations, often with no local IT support, produce additional challenges for the data centre and IT teams as they seek to ensure a seamless, always-on application service, whatever the infrastructure and wherever the data resides.
Modern applications and their configurations are updated continuously due to CI/CD. Modern virtualized, cloud-based and, Kubernetes-based environments all exhibit automated and dynamic behavior which both change configurations and the relationships between services and the components that they depend upon. Traditional APM and infrastructure monitoring solutions are unable to capture these changes as they occur and relate them to the resulting problems with application performance and reliability. Dynamic observability solutions uniquely capture all of these changes in the end-to-end application system and automatically relate them to issues with the performance and reliability of your critical dynamic applications.
Watch this roundtable to understand the trends impacting today's modern IT environments, and join Bernd Harzog of APM Experts, Mark Arts, Senior Solutions Engineer and Allyson Barr, CMO of StackState, to learn how observability solutions like StackState can improve your existing monitoring tools and processes with real-time, dynamic, and comprehensive observability of relationships and changes.
Explore MSP success through skilled workforce and positive culture. Learn investing in skills, training, talent, and culture for growth. Share best practices for recruitment, retention, and inclusive leadership.
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Discover actionable insights on maximizing the value of your MSP business. Explore tactics for scalability, strategic positioning, and profitability enhancement, empowering sustainable growth and potential for future sale.
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Compound semiconductors, like SiC and GaN, are increasingly attractive for their ability to operate at higher voltages, currents, and frequencies, especially in power and RF devices. However, fabricating wafers using these compounds has proven to be challenging, which can adversely impact manufacturing yield and costs. In addition to conventional semiconductor defects, one of the challenges is the presence of crystalline dislocations that are often difficult to identify and characterize.
This webinar will use real world use cases to discuss; defects including crystalline dislocations, cross-section and TEM lamella focused ion beam sample preparation, and the performance advantages provided by ion sources other than Ga+. We will also dive into the complexities and crucial requirements associated with (S)TEM analysis.
As you'll discover from this discussion, sample preparation and TEM elemental analysis serve not only as powerful tools for identifying and root causing defects but are essential for acquiring insights to inform and enhance manufacturing processes.
SiC has superior efficiency to (Si) IGBT in the high voltage (600-3,300V) space and the high current (several hundred amperes) field that is in the spotlight in relation to EVs. SiC MOSFETS issues to be solved for the SiC market expansion are: substrate size, supply and defect density; device on resistance and trade off with short circuit and bipolar degradation; voltage surge and ringing linked to fast switching. In particular, the issues of reducing SiC MOSFET chip cost ($/amp) should be a top priority. A review of industry challenges and future development will be presented. We will also focus on how SiC substrates will enable to address those challenges through advanced substrates engineering.
Whether you choose to call this ecosystem Hybrid Digital Infrastructure Management or Digital Operations Management, there is no doubt that AIOPS has a major role to play in a digital business.
Find out how AIOPS has helped enterprise organisations as they have developed successful Digital Change Management strategies; and discover the future for AIOPS - how it will work alongside other Ops disciplines to help end users to achieve application performance optimisation.
Upgrading your power supply design from Si to SiC can appear daunting due to the different gate drive requirements and considerations of EMI suppression and thermal properties. But in reality, you have the same design considerations as with any power supply. In this webinar we will share a few tips to accelerate the design process, including what to expect when measuring performance; how to choose the right SiC device and surrounding components, and finally, our PCB layout recommendations.
Recent Webinars/Roundtables |